ForMatter/Processes/finishing/Gold Electroplating (Jewelry)
proc_electroplating_gold_jewelry

Gold Electroplating (Jewelry)

finishing · gold plating, gold electrodeposition, vermeil (gold over silver), gold-plated

A thin layer of gold deposited from solution onto a metal surface by electrolysis — the gold ions in the bath are pulled to the cathode (the part) and reduce to metallic gold against the surface. The reason "gold-plated" jewelry exists, the reason gold-plated electrical contacts work, the reason most luxury watch cases that aren't solid gold look like solid gold. Plating thickness ranges from sub-micron flash to 5 µm heavy gold-fill.

Electrolytic deposition of Au from a cyanide-, sulfite-, or chloride-based plating bath. Cathode current density 1–5 A/dm², bath temperature 25–70 °C depending on chemistry. Plating thickness ranges: gold flash 0.05–0.25 µm (decorative only), gold electroplate 0.5–2.5 µm (light wear), heavy gold electroplate 2.5–5 µm (gold-filled territory). Underplate (typically Ni or Pd) common to prevent diffusion of substrate metal through to the surface; vermeil (gold over sterling silver per FTC standard) requires sterling base + 2.5 µm minimum gold.

Scale & Tolerance

  • scale (mm)1 – 1000
  • tolerance (mm)0.01
  • skillintermediate — bath maintenance, current density, and substrate prep all matter
  • costlow per part; bath chemistry maintenance dominates operating cost

Equipment

  • school_shopsmall bench-top plating tank with rectifier and selection of bath chemistries
  • professionalproduction plating line with multiple bath chemistries, automated rinse, and waste-treatment loop
  • industrialrack / barrel plating cell with dedicated waste-water treatment

Environmental

  • energy_uselow (small rectifier currents)
  • waste_streamspent plating solution (regulated waste), rinse water (treated), cyanide-bearing baths (regulated)
  • consumablesgold salts, supporting electrolytes, anodes

Citations